IC Leadframe Dies
For semiconductor packages for integrated circuits like LSI, which are essential for cutting-edge technology, an IC lead frame is a thin metal sheet. When installing semiconductor packages on printed circuit boards, the component serves as a connecting terminal, supports and fixes semiconductor chips (IC chips) in place, and is utilized for internal wiring.
A semiconductor chip is supported and fixed in place by a die pad, which is made up of an inner lead for internal wiring with the chip and an exterior lead that acts as a connection point to external wiring.
IC lead frame dies must be produced using advance technologies. We can handle a narrower tip with our fine-processing technology for making die parts.
Lebon Product Title One
Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an unknown printer took a galley of type and scrambled it to make a type specimen book.
Lebon Product Title Two
Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an unknown printer took a galley of type and scrambled it to make a type specimen book.
Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an unknown printer took a galley of type and scrambled it to make a type specimen book.
Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an unknown printer took a galley of type and scrambled it to make a type specimen book.
Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an unknown printer took a galley of type and scrambled it to make a type specimen book.
Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an unknown printer took a galley of type and scrambled it to make a type specimen book.